Infineon Technologies 165-FBGA CY7C1315KV18-300BZC

Gaisi Electronics recognizes the paramount importance of quality, meticulously overseeing every facet to ensure the excellence of our chips right from the source. Our supplier audit and grading system guarantee the authenticity of the raw materials we procure. Through a stringent quality inspection process and testing conducted by qualified third-party agencies, we fortify the quality assurance of our products. Additionally, we adhere to rigorous standards in warehousing, packaging, and transportation to ensure the secure and complete delivery of our products to you.

The CY7C1315KV18-300BZC is a high-performance Static Random Access Memory (SRAM) device from Cypress Semiconductor, offering 1M x 16 bits of storage capacity. It operates at a speed of 300 MHz and features a low-voltage operation with a supply voltage range of 1.8V. This particular part comes in a BZC package, which stands for Ball Grid Array (BGA), providing high density and efficient thermal management. It's designed to meet the needs of demanding systems requiring fast data transfer rates and reliable temporary data storage.