Infineon Technologies 165-FBGA CY7C2263XV18-600BZXC

Gaisi Electronics sells chip products using the most advanced process technology and materials to achieve a high level of integration, allowing you to obtain more powerful functions in a limited space. At the same time, we optimize the production process and reduce costs, allowing you to obtain high-quality products at more favorable prices.

The part number CY7C2263XV18-600BZXC refers to a Cypress Semiconductor SRAM device with a high-speed interface and a capacity likely in the multi-Mbit range, featuring advanced performance and possibly built-in IEEE 1149.1 (JTAG) boundary scan support for testing. It operates at a speed grade of 600, indicating a fast access time, and comes in a BZXC package suitable for high-density mounting on PCBs. This SRAM series is designed for applications demanding high-speed data transfer and reliable testability. However, please note that specific details are not provided without consulting its datasheet for accurate specifications.