Cypress Semiconductor Corp 165-FBGA CY7C2570XV18-600BZXC

Gaisi Electronics provides chips characterized by high-speed processing and real-time response capabilities, enhancing the smooth operation and swift responsiveness of your applications for an improved user experience. Our chips are versatile, supporting a range of diverse interfaces to adapt seamlessly to various scenarios. Whether you're in the realms of smart home technology, industrial automation, or the Internet of Things, Gaisi Electronics ensures you'll find a tailored solution to suit your needs.

The CY7C2570XV18-600BZXC is a high-density SRAM device from Cypress Semiconductor. It offers a substantial memory capacity and supports the IEEE 1149.1 JTAG boundary scan for simplified testing. This part operates within a specified voltage range and comes in a 165-ball FBGA package, typically with a dimension of 13x15 array. Designed for high-speed data transfer and reliable performance, it is suitable for demanding applications where large storage and fast access are critical. However, specific details like speed grade (-600), memory size, and operating conditions can only be ascertained by referring to its datasheet.