Shenzhen Gaisi Electronics Technology Co.,Ltd
Aaron_liu
86-18664915172
86-0755-21046771
86-0755-21046771
aaron@gselectro.com
深圳市福田区振华路122号海外装饰大厦4B10
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The MCP2021T-330E/SNVAO is a Multi-Chip Package (MCP) product, integrating Samsung's mobile DRAM and NAND Flash memory in a compact SMD form factor. It offers a space-saving solution for devices requiring both types of memory components. This specific part number suggests a variant with particular specifications or features suitable for certain applications, possibly within the realm of communication devices where high-density storage and fast data access are essential. Availability, pricing, and detailed datasheet information can be found through electronic component distributors, often including options for small quantity orders and immediate shipment.